In PCB manufacturing, the hole size to thickness ratio , also known as the aspect ratio , is a critical factor that influences the quality of hole plating. This ratio is calculated by dividing the PCB ...

Preventing plating and soldering voids is about testing new manufacturing processes and analyzing the results. Plating and soldering voids usually have an identifiable cause, such as the type of ...

Copper-clad is to use the unused space on the PCB as the reference surface, and then fill it with solid copper, which is also called copper filling. The significance of copper clad is to reduce the ...

Eurocircuits, a European producer of small batch PCBs, has teamed up with Elsyca, a Belgian research company specialising in advanced electrochemical modelling, to implement PCB plating using Elsyca’s ...

Today’s electronic packages have high clock speeds (multi-gigahertz range), fine pin densities (below 0.4-mm pitch), and high pin counts (over 2000). When assembled onto a printed-circuit board (PCB), ...