The shift to multi-die assemblies is forcing changes in how chips are tested and inspected in order to achieve sufficient yield ramp or respond more quickly to yield excursions.

The move to multi-die packaging is driving chipmakers to develop more cost-effective ways to ensure only known-good die are integrated into packages, because the price of failure is significantly ...

Not every die-inspection problem succumbs to emission microscopy. But more of today’s backside challenges are disappearing as CAD navigation software and the microscope join forces. Emission ...