Flip-chip bonding is the process of bonding on-chip electrodes to printed circuit board (PCB) electrodes using Au bumps. The bond strength influences the circuit’s conductivity directly, without the ...

So, you’ve probably heard about flip chip IC technology, maybe in passing or maybe you’re knee-deep in a project that needs it. It’s this pretty neat way of putting computer chips onto circuit boards.

A new technical paper titled “Noncontact excitation of multi-GHz lithium niobate electromechanical resonators” was published by researchers at Yale University. “The demand for high-performance ...

Fujitsu Limited announced that it has developed new technology that enables formation of ultrafine pitch 35 micron (center-to-center distance of bumps) solder bumps (*1), and high-precision flip-chip ...

Undetected bonding pressure variations can result in poor or open flip chip connections, reducing yield and long-term reliability while raising costs. Maintaining a uniform distribution of bonding ...

Editor’s preface: There is increasing interest in the ‘new’ smart card chip manufacturing technique known as Flip Chip. An alternative to the tradional manufacturing process that attached chips to ...

Bumping technologies for advanced semiconductor packaging have evolved significantly to address the challenges posed by shrinking contact pitches and the limitations associated with conventional ...

Not so long ago, defense and aerospace applications were the traditional drivers of advances in electronic packaging technologies, or "the way electronic systems are assembled." At the time, cost was ...