The small and complicated features of TSVs give rise to different defect types. Defects can form during any of the TSV ...

The printed circuit board assembly process has undergone revolutionary changes over the past three decades. What once relied ...

As the core technology used in modern electronics manufacturing, surface-mount technology (SMT) assembly density is increasing, the number of pins is increasing, and the pitch is decreasing. In ...

The complexities associated with the use of solders in electronic products. What’s the alternative to solder? A long-standing adage observes that “if the only tool in your tool chest is a hammer, the ...

In recent years, the area array components like BGA, QFN, CSP, and flip chips, are aplicate wider and wider in the electronics manufacturing. Such as BGA, comparing with other components, it has ...

In the semiconductor industry, the outsourced semiconductor assembly and test (OSAT) sector plays a pivotal role in the global technology landscape. As the backbone of electronic device manufacturing, ...

As electronic products move from prototyping to mass production, manufacturers must rely on efficient, scalable, and ...

AXI is an effective technology for finding manufacturing defects in electronics assembly operations. Manufacturers of advanced electronics products know that simultaneously producing a ...

The result is that the entire board is much denser, and comments can be installed on both sides of the PC board, as seen in Figure 2 . Since the board does not require drilling for component leads ...